A: PCB: Quantity, Gerber file and Technic requirements(material,surface finish treatment,
copper thickness,board thickness ,...)
PCBA: PCB information, BOM, (Testing documents...)
STG manufacturing service
HDI PCB
High-density interconnect fabrication for compact layouts requiring microvias, fine geometry, and controlled stackup planning.
Built around your project data
HDI PCB with clear engineering assumptions
High-density interconnect fabrication for compact layouts requiring microvias, fine geometry, and controlled stackup planning.
We align the production route with design complexity, volume, inspection access, test requirements, and delivery expectations before work begins.
Customization Capabilities
Tailored PCB Manufacturing for Every Design Requirement
From substrate selection to final surface finish, every parameter of your board is configurable. Our engineering team reviews your design package and configures the exact production route needed to meet performance, reliability, and cost targets.
Material & Substrate
Standard FR-4, high-Tg FR-4 (Tg 170°C+), high-frequency laminates (Rogers, PTFE, hydrocarbon), aluminum / metal-core, CEM-1, flexible polyimide, and rigid-flex hybrid constructions.
Layer Count & Stackup
1 to 40+ layer constructions with custom dielectric stackup design. Impedance-controlled builds (single-ended 50Ω / 75Ω, differential 90Ω / 100Ω), blind and buried vias, and asymmetric layer configurations.
Copper Weight
0.5 oz standard through 10 oz heavy copper for high-current power boards. Mixed copper weights on inner and outer layers, optimized for power delivery, thermal management, and signal integrity.
Surface Finish
HASL, lead-free HASL, ENIG, ENEPIG, immersion silver, immersion tin, OSP, and selective hard gold for edge connectors / gold fingers. Selected based on assembly process, shelf life, and contact durability.
Advanced Processes
HDI any-layer interconnect, microvias (≤0.15mm), via-in-pad with epoxy fill, plated half-holes / castellations, edge plating, countersink holes, and back-drilling for high-speed signal integrity.
Form Factor & Appearance
Custom board outlines, V-scoring, tab-routing (mouse-bites), and arbitrary shapes. Solder mask in green, black, blue, red, white, or matte black; legend/silkscreen printing, carbon ink, peelable solder mask, and conductive ink.
Not sure which configuration fits your project? Send your design files for a free engineering review.
Request Custom QuoteCore capabilities
What the service can include
Final scope is confirmed after technical review of the project package.
Microvia strategy
Review via types, aspect ratio, stacking, staggering, and reliability risk.
Fine geometry
Confirm trace, space, annular ring, and registration requirements.
Stackup control
Align dielectric, copper, impedance, and sequential lamination requirements.
Production path
How we prepare and control the work
Data review
Review design files, quantities, acceptance criteria, and delivery target.
Engineering plan
Confirm materials, process route, inspection, testing, and project assumptions.
Controlled build
Run the approved process with defined inspection and traceability checkpoints.
Final verification
Complete final inspection, reporting, packing, and delivery release.
Quote with fewer assumptions
Send the files that define success
Include Gerber or ODB++, BOM, assembly drawings, quantities, acceptance criteria, programming files, test instructions, and delivery targets where applicable.
Service questions
Answers before you request a quote
A: Gerber file: CAM350 RS274X
PCB file: Protel 99SE, P-CAD 2001 PCB
BOM: Excel (PDF,word,txt)
A: Your files are held in complete safety and security.We protect the intellectual property for our customers in the whole
process.. All documents from customers are never shared with any third parties.
A: We can handle OSP,HASL,Gold immersion, silver immersion with RoHS and Non RoHs.
A: We generally use normal FR-4,(epoxy or fibre glass), we can also provide high TG FR-4 that meeting stringent requirement on temperature.
In addition, we can handle FR-1,FR-2(94V0), CEM-1, Aluminium base material according to customer?? s special requirement.
The specification has 0.8mm,1.0mm, 1.2mm,1.6mm, 1.8mm, 2.0mm,2.4mm thickness.